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德国INFINEON 工艺技术公司与台湾半导体厂商南亚科技已经签定了在标准存储器芯片(DRAM)领域里合作的非约束性协议。根据这一协议,两公司以开发费用分担的形式,从2002年10月开始共同开发300mmSi园片加工中来用的0.09μm以及0.07μm工艺技术。两公司各出资一半,建设DRAM芯片生产的合资公司,在台湾共同建设300mmSi圆片加工工厂,计划从2003年开始生产、2004年下半年完成的第一阶段建设所形成的生产能力为每月投入量2万片。合资
German INFINEON process technology company and Taiwan semiconductor manufacturer South Asia science and technology have signed non-binding agreement in the field of standard memory chip (DRAM) cooperation. According to this agreement, the two companies began to jointly develop the 0.09 μm and 0.07 μm process technologies used in the processing of 300 mm Si wafers from October 2002 in the form of sharing of development costs. The two companies have invested half of their capital to build a joint venture company for DRAM chip production and jointly build a 300mmSi wafer processing plant in Taiwan. The planned production capacity from the start of production in 2003 and the first phase of construction completed in the second half of 2004 will be a monthly investment. 20,000 pieces. joint venture