由于表面活性物质对金属离子在阴极上电沉积的性质有良好的影响,因而近年来表面活性物质开始以附加剂的形式广泛地应用于电镀(尤其是镀镍)技术中。为控制表面活性物质使在电镀液中的浓度保持一定的范围,而要求对电镀液中表面活性剂的含量作必要的定量分析,就显得越来越重要了。最近,某些电镀研究与生产部门,开始在镀镍电解液中添加少量的作为阴离子表面活性剂的烷基磺酸钠或烷基硫酸钠。关于此类阴离子表面活性剂定量分析 Since surface-active substances have a good effect on the properties of metal ions electrodeposited on cathodes, surface-active substances have been widely used in the form of additives in electroplating (especially nickel plating) technology in recent years. In order to control the surface active substances in the plating solution to maintain a certain concentration range, and the requirements of the surfactant in the plating solution to make the necessary quantitative analysis, it becomes more and more important. Recently, some electroplating research and manufacturing departments began to add a small amount of sodium alkyl sulfonate or sodium alkyl sulfate as an anionic surfactant to the nickel plating electrolyte. Quantitative Analysis of Such Anionic Surfactants