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采用ＢＦ＿２注入基区加快速热处理工艺的３０ＧＨｚｆ＿Ｔ亚微米双层多晶硅双极技术的工艺和器件特性表征＝ｐｒｏｃｅｓｓａｎｄｄｅｖｉｃｅｃｈａｒａｃｔｅｒｌｚａｔｉｏｎｆｏｒａ３０－ＧＨｚｆ＿Ｔｓｕｂｍｉｃｒｏｍｅｔｅｒｄｏｕｂｌｅｐｏｌｙ－Ｓｉｂｉｐｏ...
Process and device characterization of 30GHzf_T sub-micron double-layer polysilicon bipolar technology with BF_2 injection into the base to speed up the rapid thermal process ... processanddevicecharacterlzationfora30-GHzf_Tsubmicrometerdoublepoly-Sibipo ...