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采用对比分析的方法,观察了Cu/Sn58Bi/Cu和Ni/Sn58Bi/Ni焊点在匀强磁场下的凝固显微组织变化,研究了静磁场对焊点凝固显微组织的影响。结果表明:静磁场条件下,焊点的三明治结构在凝固过程中使界面附近产生明显温度梯度,导致界面附近的显微组织层片间距增大;慢速冷却利于粗大规则的共晶组织形成;Ni基板焊点的界面金属间化合物形成不规则的锯齿状结构。
By means of comparative analysis, the microstructures of Cu / Sn58Bi / Cu and Ni / Sn58Bi / Ni joints under uniform magnetic field were observed. The effect of static magnetic field on the microstructures of the joints was investigated. The results show that under the static magnetic field conditions, the sandwich structure of the solder joints produces a significant temperature gradient near the interface during the solidification process, resulting in an increase in the spacing of the microstructure layers near the interface. Slow cooling facilitates the formation of coarse regular eutectic structures. Interfacial intermetallics of the Ni substrate solder joint form an irregular jagged structure.