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对LED的导散热理论进行了研究,推导出了倒装焊LED芯片结温与封装材料热传导系数之间的关系。通过分析倒装焊LED的焊球材料、衬底粘结材料和芯片内部热沉材料对芯片结温的影响,表明衬底粘结材料对LED的结温影响最大,并且封装材料热传导系数的变化率与封装结构的传热厚度成反比,与传热面积成正比。该研究为倒装焊LED封装结构和材料的设计提供了理论支持。
The heat conduction theory of LED is studied, and the relationship between the junction temperature of flip-chip LED chip and the thermal conductivity of the package material is deduced. By analyzing the solder ball material of flip-chip LED, substrate adhesive material and chip heat sink material on the junction temperature of the chip, indicating that the substrate bonding material LED junction temperature greatest impact, and packaging materials thermal conductivity changes The rate is inversely proportional to the heat transfer thickness of the package structure and is proportional to the heat transfer area. The research provides theoretical support for the design of flip-chip LED package structure and materials.