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采用单辊快速凝固方法制备出高强度高导电的Cu－Cr－Zr合金，对时效过程中电阻率和显微硬度的变化进行了研究，用扫描电镜和透射电镜对析出过程中晶粒与析出相的形态与大小及位错的组态进行分析．结果表明：时效初期电阻率的下降是溶质原子借高浓度的空位迅速偏聚和析出所致。在500℃温度下，时效30min，合金的导电率可达82％IACS，显微硬度为Hv202。细小弥散分布的析出相是导致高硬度的主要原因。
High-strength and high-conductivity Cu-Cr-Zr alloy was prepared by single roll rapid solidification method. The changes of resistivity and microhardness during aging were studied. The effects of precipitation and grain size during the precipitation process were analyzed by SEM and TEM. Phase morphology and size and dislocation configuration analysis. The results show that the decrease of resistivity at the initial stage of aging is caused by the rapid segregation and precipitation of solute atoms by high vacancy. At 500 ℃ temperature, aging 30min, the conductivity of the alloy up to 82% IACS, microhardness Hv202. Finely dispersed precipitated phase is the main reason leading to high hardness.