Powder in tube process (PIT) was adopted for the fabrication of single filament Bi-2223 tapes, and a heat treatment process including the first heat treatment (HT1), intermediate rolling (IR), and second heat treatment (HT2) was performed. The phase evolution mechanism and microstructure changes during these heat treatment processes were systematically discussed. The influences of HT1 parameters on the phase evolution process of Bi-2223 tapes were discussed. With the optimized HT1 process, a proper Bi-2223 content of about 90% was achieved. HT2 process was also optimized by adding a post annealing process. An obvious increase of current capacity was obtained due to the enhancement of intergrain connections. Single filament Bi-2223 tapes with the critical current of Ic-90 A were fabricated with the optimized sintering process.