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芯片结构观察广泛应用于芯片的生产、工艺改进、失效分析和可靠性等领域。芯片结构分为剖面结构和表面各层结构,对芯片进行切片是观察其内部结构的一种较为简便的方法。研磨抛光切片是一项低成本的切片技术,但由于精度较低、操作复杂,较少应用于芯片的结构观察。详细说明了研磨抛光切片技术的原理,给出了改进后的切片工艺,并通过实例说明该方法在芯片剖面结构观察和表面各层结构观察中的应用。该方法可满足大部分情况下对芯片结构观察的需要。讨论了该技术目前存在的问题。
Chip structure observation is widely used in chip production, process improvement, failure analysis and reliability and other fields. The chip structure is divided into the cross-sectional structure and the surface layer structure, slicing the chip is a simple way to observe its internal structure. Grinding polished sections is a low-cost sectioning technique that is less used for structural observation of the chip because of its lower accuracy and complexity of operation. The principle of lapping and polishing sectioning technology is described in detail. The improved slicing process is given. The application of this method in the observation of chip section structure and the observation of the structure of each layer surface is illustrated by an example. This method can meet the needs of chip structure observation in most cases. Discussed the current problems of the technology.