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针对X射线二极管平响应滤片的设计要求,采用电子束蒸发生长薄金层、紫外光曝光光刻、微电镀厚金层、体硅腐蚀制作镂空结构和等离子体刻蚀去掉PI等技术,成功制备了阵列结构的圆孔直径为5μm,周期为10.854μm,金层厚度分别为50,400nm的薄、厚两种金层滤片。电镀过程中采用台阶仪多次测量图形四周电镀厚度后取均值的方法得到尽可能准确的电镀厚金层。滤片交付实验后,在X光能量0.1～4keV取得的平响应曲线标准偏差与均值之比在13%以内,可以满足相关单位的具体物理研究实验要求。
According to the design requirements of X-ray diode flat response filter, thin layer of gold is grown by electron beam evaporation, ultraviolet exposure lithography, thick gold layer of micro-plating, etching of bulk silicon and the plasma etching to remove PI and so on. The gold and silver filters with the diameter of 5μm, the period of 10.854μm and the thickness of gold layer of 50,400nm were fabricated. Plating process using the stepper to measure the thickness of the figure several times around the thickness of the average value of the method to get as thick as possible thick layer of electroplating. After the filter delivery experiment, the standard deviation of the flat response curve obtained from 0.1 to 4 keV of X-ray energy is less than 13% of the average value, which can meet the requirements of specific physical research experiments of relevant units.