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为了研究激光温喷丸对IN718镍基合金高温释放行为的影响,以20℃室温激光喷丸(LP)和260℃激光温喷丸(WLP)处理的IN718镍基合金为研究对象,从微观组织、残余应力等角度,通过保温试验探索了温度、时间与残余应力释放的关系,并从高温软化和蠕变理论角度对残余应力的高温释放规律进行分析。结果表明,WLP较LP处理的IN718镍基合金具有更好表面高温稳定性和更高位错密度,且晶粒细化更为明显;随着保温温度的升高,LP和WLP处理件残余应力释放幅度均明显增大,但前者释放速度更快,且位错密度有明显减小的趋势;700℃保温500 min后,LP和WLP处理件表面残余应力分别释放68%和36.7%,最大残余应力释放率出现在保温初始阶段,且释放规律符合Zener-Wert-Avrami函数。
In order to study the effect of laser shot peening on the high temperature release behavior of IN718 nickel base alloy, IN718 nickel-based alloy treated by laser blasting at 20 ℃ and WLP by 260 ℃ was studied. , Residual stress and other perspectives, the relationship between temperature and time and residual stress release was explored through thermal insulation test. The high temperature release of residual stress was analyzed from the perspective of high temperature softening and creep theory. The results show that WLP possesses better surface high temperature stability and higher dislocation density than LP treated IN718 nickel alloy, and the grain refinement is more obvious. With the increase of holding temperature, the residual stresses of LP and WLP treated parts are released But the former tended to release faster and the dislocation density decreased obviously. After 500 min of 700 ° C, the surface residual stresses of LP and WLP were 68% and 36.7% respectively, and the maximum residual stress The release rate appeared in the initial stage of heat preservation, and the release rule was in accordance with Zener-Wert-Avrami function.