近五十年来,世界电子工业发展速度惊人。其中,半导体产业起着核心作用。最近,随着智能手机、平板电脑的需求急速扩大,在LSI的大容量化、高速化,低功率化的同时,对半导体封装(PKG)的小型化,薄型化的要求愈来愈烈。另一方面,由于以LSI高性能化为首的微细化技术的难易度提高,作为实现半导体PKG的大容量化,高集成化核心技术的组装技术引人注目。近年来,内存和逻辑等不同的半导体PKG层叠的叠层封装(PoP)等三维半导体PKG市场在不断地扩大,支撑该半导体PKG发展的是印制线路 In the past 50 years, the world electronics industry has witnessed an alarming rate of development. Among them, the semiconductor industry plays a central role. Recently, with the demand for smartphones and tablets rapidly expanding, demand for miniaturization and thickness reduction of semiconductor packages (PKGs) has become increasingly greater as LSIs have become larger in capacity, higher in speed and lower in power. On the other hand, due to the increased sophistication of miniaturization technologies including high-performance LSIs, there is a growing interest in assembly technologies for increasing the capacity of semiconductors PKGs and highly integrated core technologies. In recent years, the market of three-dimensional semiconductor PKG, such as multi-layer semiconductor package (PoP), such as memory and logic, has been expanding. In order to support this semiconductor PKG, a printed circuit