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根据Au-Ag-Ge三元相图,制备了新型Au-19.25Ag-12.80Ge(质量分数,%)钎料合金。利用DTA、扫描电镜对钎料的熔化特性及显微组织进行分析,并对其与纯Ni的润湿性加以研究。结果表明:钎料合金熔化温度为446.76~494.40℃,结晶温度区间为47.64℃。焊接温度在510~550℃范围内时,钎料合金与Ni的润湿性较好,同时有润湿环出现;钎料合金与Ni基体之间形成了一条明显的扩散层,能谱分析表明,该扩散层为Ge-Ni金属间化合物。采用先包覆铝热轧再冷轧,结合中间退火的加工工艺可制备厚度0.1mm的钎料薄带。
According to the Au-Ag-Ge ternary phase diagram, a novel Au-19.25Ag-12.80Ge (mass fraction,%) solder alloy was prepared. The melting characteristics and microstructure of the brazing filler metal were analyzed by DTA and SEM, and the wettability with pure Ni was studied. The results show that the melting temperature of solder alloy is 446.76 ~ 494.40 ℃ and the crystallization temperature is 47.64 ℃. When the welding temperature is in the range of 510 ~ 550 ℃, the wettability of the solder alloy with Ni is better and the wetting ring appears at the same time. An obvious diffusion layer is formed between the solder alloy and the Ni matrix. , The diffusion layer is a Ge-Ni intermetallic compound. The first coated aluminum hot-rolled and then cold-rolled, combined with the intermediate annealing process can be prepared with a thickness of 0.1mm solder ribbon.