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目前,导电涂层已广泛应用于工业领域。如采用溅射技术在LCD或OLED平板加工过程中涂布ITO层,以及在电子印刷器件基材表面制备基极层。然而,传统涂布工艺(电子束溅射、旋转涂布等)在工业生产中存在一些问题:这些工艺不仅成本高,而且需要真空等苛刻的生产环境。近年来,研究人员已经提出用各种印刷工艺来替代传统的涂布工艺。本文提出将静电喷雾沉积(ESD)印刷工艺应用于ITO涂层和导电涂层的制备。此外,为了更好地应用静电喷雾沉积工艺,本文也研究了喷嘴和外加电压对不同类型喷头的影响。
At present, the conductive coating has been widely used in industrial fields. Such as using sputtering technology in the LCD or OLED plate coating process of ITO layer, as well as the electronic printing device substrate surface preparation base layer. However, conventional coating processes (electron beam sputtering, spin coating, etc.) have some problems in industrial production: these processes are not only costly but also require harsh production environments such as vacuum. In recent years, researchers have proposed a variety of printing processes to replace traditional coating processes. In this paper, electrostatic spray deposition (ESD) printing process is applied to the preparation of ITO coating and conductive coating. In addition, in order to better apply electrostatic spray deposition process, this paper also studied the nozzle and applied voltage on different types of nozzles.