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采用活性钎料Cu70Ti30对Al2O3陶瓷与Q235钢进行了连接。用扫描电镜、能谱仪和X射线衍射仪对焊接界面进行了微观表征。结果表明,1100℃是最佳的钎焊温度,该温度下钎料充分熔化填充接头间隙并与陶瓷和钢侧相互扩散,形成由三层构成的界面结合区,即液态钎料填充陶瓷微孔形成的反应层、Ti-Cu合金层以及钢侧扩散层;在界面结合区生成有AlCu4、Cu3 TiO4、TiC、TiFe2等新相;界面结合区组织致密,裂纹、微孔缺陷较少,实现了较好的冶金结合。
The active ceramic Cu70Ti30 was used to connect Al2O3 ceramic with Q235 steel. The welding interface was characterized by SEM, EDS and XRD. The results show that 1100 ℃ is the best brazing temperature at which the brazing filler metal melts to fill the joint gap and interdiffuse with the ceramic and the steel to form a three-layer interfacial bonding zone where the liquid solder fills the ceramic pores The formation of the reaction layer, Ti-Cu alloy layer and the steel side diffusion layer; in the interface junction area is generated AlCu4, Cu3Ti4, TiC, TiFe2 and other new phase; interface junction zone compact, cracks, microporous defects less realized Better metallurgical bonding.