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金铜合金作为金基合金钎焊料在电子工业电真空器件的焊接中发挥关键作用。本文采用真空感应熔炼方法制备金铜合金铸锭,通过冷轧使铸锭发生塑性变形,并结合后续的不同热处理工艺,研究了大变形量(~90%)的金铜合金在不同热处理条件下的固态相转变过程;采用光学显微镜(OM)、扫描电镜(SEM)对微观组织进行观察,发现冷变形金铜合金在673~723 K温度范围发生回复,在748~923 K发生再结晶,在923 K以上出现再结晶晶粒长大现象;随后,采用差示扫描量热法(DSC)研究了再结晶组织在连续升温-降温过程中的相转变,即升温过程中发生无序相→Au Cu I→Au Cu II→无序相的转变;而降温过程仅发生了无序相→Au Cu I相的直接转变。利用X射线衍射仪(XRD)发现再结晶组织为金的固熔体结构,而在无序-有序相Au Cu I的转变温度区间,其快淬组织为四方结构的Au Cu I结构;随后,采用高分辨透射电镜(HRTEM)观察证实了此结构,且认为该合金在临界温度以下确实存在有序相的转变。
Gold-copper alloy as a gold-based alloy brazing filler metal in the electronics industry plays a key role in the welding of vacuum components. In this paper, the vacuum induction melting method was used to prepare the ingot of gold-copper alloy, and the ingot was plastically deformed by cold rolling. Combining the subsequent different heat treatment techniques, the effects of different heat treatment conditions on the copper-copper alloy with large deformation (~ 90% The microstructure was observed by optical microscope (OM) and scanning electron microscope (SEM). It was found that the cold deformed Au-Cu alloy recovered in the range of 673-723 K and recrystallized in 748-923 K. Then, the phase transition of recrystallized structure during continuous heating-cooling process was studied by differential scanning calorimetry (DSC), that is, the disordered phase → Au Cu I → Au Cu II → disordered phase transition; while the cooling process only occurred the disordered phase → Au Cu I phase direct conversion. The recrystallized structure was found to be a solid solution of gold by X-ray diffractometry (XRD). In the transition temperature range of Au-Cu I, the quenched structure was Au Cu I structure of tetragonal structure. Subsequently, The structure was confirmed by high-resolution transmission electron microscopy (HRTEM) observation, and the transition of ordered phase did exist below the critical temperature.