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研究了1种适于电子束固化的双马来酰亚胺树脂体系。在4,4′-二苯甲烷双马来酰亚胺和双酚A-二苯醚双马来酰亚胺的低熔点混合物中加入适量的活性稀释剂、催化剂等,经300 kGy的电子束辐射,所得树脂浇铸体的玻璃化转变温度为260℃;室温模量为4.2 GPa;120℃模量为3.5GPa。用红外光谱分析法测定了经电子束辐射固化之后官能团的转化率。用热重法测定了树脂的热分解温度。
A novel bismaleimide resin system suitable for electron beam curing was studied. In 4,4’-diphenylmethane bismaleimide and bisphenol A diphenyl ether bismaleimide low melting point mixture by adding an appropriate amount of active diluent, catalyst, etc., by 300 kGy electron beam The resulting resin molded body had a glass transition temperature of 260C, a room temperature modulus of 4.2 GPa, and a 120C modulus of 3.5 GPa. The conversion of functional groups after being cured by electron beam radiation was measured by infrared spectroscopy. Thermogravimetric method was used to determine the thermal decomposition temperature of the resin.