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为探讨CCGA高密度封装结构在整机设备中的有限元建模方法,分析CCGA封装在力学激励下的响应,选用了不同的有限元单元对CCGA封装结构进行了建模,采用了约束方程方法处理不同单元所引起的求解自由度不协调问题,根据CCGA封装模型特点编写了约束方程自动建模程序。基于约束方程方法建立的有限元模型,对包含CCGA封装结构的设备整机进行了随机振动激励下的有限元仿真,得到了随机振动激励下封装的响应。通过包含CCGA封装结构的有限元模型建模过程可以看出:自动约束方程建模方法可以有效地处理实体单元与梁单元建模引起的自由度不协调问题,为包含高密度封装的设备整机有限元建模提供了新的思路;CCGA封装结构力学特性仿真结果可以较全面反映封装响应,为CCGA芯片的加固措施提供了根据。
In order to explore the finite element modeling method of CCGA high-density package structure in complete machine equipment, the response of CCGA package under mechanical excitation was analyzed. Different finite element units were chosen to model the CCGA package structure. The constraint equation method To deal with the incompatibility of solving degrees of freedom caused by different units, an automatic modeling procedure of constraint equations was developed according to the characteristics of CCGA package model. Based on the finite element model established by the constraint equation method, the finite element simulation of the whole machine including the CCGA package structure under random vibration excitation is performed, and the response of the package under the random vibration excitation is obtained. Through the modeling process of finite element model including CCGA package structure, it can be seen that the automatic constraint equation modeling method can effectively deal with the problem of uncoordinated degree of freedom caused by solid element and beam element modeling, Finite element modeling provides a new idea. The simulation results of the mechanical properties of CCGA package structure can more fully reflect the package response, which provides the basis for the reinforcement measures of CCGA chip.