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无铅焊接对设计和组装的影响The Impact of Lead-free on Design and Fabrication印制电路设计人员和厂家需要了解无铅工序,同供应商和客户交流,是很好的起点。设计人员必须确保元件及封装能够承受无铅工序所需的较高回流温度,通常为255℃到260℃。特性阻抗也可能成为挑战。在
The Impact of Lead-Free Soldering on Design and Assembly The printed circuit designers and manufacturers need a good lead-out to understand lead-free processes, communicate with suppliers and customers. Designers must ensure that components and packages are capable of withstanding the higher reflow temperatures required for lead-free processes, typically 255 ° C to 260 ° C. Characteristic impedance can also be a challenge. in