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利用电阻温度系数法对冷弹压法、缠钼带热挤压法、石墨热挤压法、磁控溅射覆膜法及新型的无变形热挤压法制备的慢波组件散热性能进行了实验研究,结果表明石墨热挤压法、磁控溅射覆膜法和无变形热挤压方法比冷弹压法和传统的缠钼带热挤压法制备的慢波组件散热性能强许多。传统的石墨热挤压法可与无变形热挤压法制备的组件的散热能力相比拟,但石墨热挤压法会引起慢波组件的两次变形,使慢波组件的微波反射点增多增强,溅射镀膜法比无变形热挤压法制备的慢波组件散热性能强一些,但由于焊接法工艺的复杂性降低了其优势。这些结果为制备散热性能强的慢波组件提供了有益的实验结果。
The thermal performance of the slow-wave components prepared by cold-spring-pressing method, hot-banding with molybdenum ribbon, graphite hot-extrusion method, magnetron sputtering film-coating method and the new non-deforming hot extrusion method were tested by means of resistance temperature coefficient The results show that the hot-swappable graphite, the magnetron sputter-coated and non-deformable hot-extrusion methods have much better heat-dissipating performance than the cold-swappable and the traditional molybdenum-ribbon hot-extrusion methods. Conventional graphite hot extrusion method can be compared with the heat-dissipating ability of the components prepared by the non-deforming hot extrusion method, but the graphite hot extrusion method causes the two deformations of the slow wave component to increase and increase the microwave reflection points of the slow wave component The sputter coating method is better than that of the slow wave component prepared by the non-deformation hot extrusion method, but its advantages are reduced due to the complexity of the welding method. These results provide useful experimental results for the preparation of slow-wave components with high heat dissipation performance.