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该测量系统采用激光瞄准和激光测距技术，装有角隅棱镜的磁性定位和轻型导轨，实现了高精度大直径直接测量，同时使仪器轻便操作，能够在加工现场或加工机床上进行在位测量。关键技术包括：使用了体积小重量轻的半导体激光长距离高精度准直系统，准直激光束光斑圆整，有效抑制
The measurement system uses laser sighting and laser ranging technology, magnetic positioning with corner cube and light rail, enabling direct measurement of large diameters with high accuracy while allowing the instrument to operate lightly, enabling on-site or machine-in-place measuring. The key technologies include: the use of small size and light weight semiconductor laser long-range high-precision collimation system, collimated laser beam spot round, effectively inhibit