众所周知,半导体器件芯片对于在其表面上的气体和离子的分布是很敏感的。由于外界引入的水汽和钠离子等杂质的污染,将导致芯片上金属化引线和健合点的腐蚀而引起开路,整个电路的性能会发生劣化直到完全失效。因此,为了保证器件长期工作的可靠性,必须要有一个稳定而洁净的与外界隔绝的良好环境,亦是说,用以封装的管壳必须具有高度的气密性。 It is well known that semiconductor device chips are sensitive to the distribution of gases and ions on their surface. As a result of the introduction of water and sodium ions and other impurities in the outside world, will lead to corrosion of metal leads and junctions on the chip and cause open circuit, the performance of the entire circuit will deteriorate until it completely fails. Therefore, in order to ensure the long-term reliability of the device, it is necessary to have a stable and clean environment that is isolated from the outside world. In other words, the package to be packaged must have a high degree of air-tightness.