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采用间位沉析纤维对对位聚芳酰胺纸进行增强,研究沉析纤维的添加对芳纶纸机械性能和电气绝缘性能的影响,并使用扫描电子显微镜研究芳纶纸表面微观结构。研究表明,沉析纤维的添加对对位聚芳酰胺纸具有显著的增强效果,可以明显增强其机械性能;同时又可使其保持较高的绝缘性能。当沉析纤维添加量为20%时,对位聚芳酰胺纸可以达到理想的增强效果,与不添加沉析纤维相比,成纸的抗张指数、伸长率和撕裂指数分别增加55.3%,49.5%和22.1%。
The meta-aramid paper was reinforced by meta-heme fiber. The influence of the deposition of fibroin on the mechanical properties and electrical insulation properties of aramid paper was studied. The surface microstructure of aramid paper was studied by scanning electron microscopy. The results show that the addition of fibroin has a significant enhancement effect on the para-aramid paper, which can significantly enhance its mechanical properties; while maintaining its high insulation properties. When the amount of fibroin is 20%, the para-aramid paper can achieve the desired enhancement effect, and the tensile index, elongation and tear index of the paper increase by 55.3 %, 49.5% and 22.1%.