意法半导体(ST)率先将硅通孔技术(TSV)引入MEMS芯片量产。在意法半导体的多片MEMS产品(如智能传感器、多轴惯性模块)内,硅通孔技术以垂直短线方式取代传统的芯片互连线方法,在尺寸更小的产品内实现更高的集成度和性能。硅通孔技术利用短垂直结构连接同一个封装内堆叠放置的多颗芯片,相较 STMicroelectronics (ST) took the lead in the introduction of TSV technology into MEMS chip production. Within STMicroelectronics’ multi-chip MEMS products, such as smart sensors and multi-axis inertial modules, TSV technology replaces the traditional chip interconnect approach with vertical stub lines to achieve higher levels of integration in smaller form factors And performance. Through-silicon vias use short vertical structures to connect multiple chips stacked in the same package