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248 nm准分子激光直接刻蚀钠钙玻璃微通道来制作生物芯片具有较大优势和潜力,但目前存在易发生碎裂、微通道底面处粗糙度高等问题.采用248 nm准分子激光束以静态刻蚀及扫描直写刻蚀两种方式刻蚀钠钙玻璃来对低裂损工艺进行研究.首先通过实验研究了激光加工玻璃的工艺参数与玻璃微通道的刻蚀质量之间的关系,然后分析了248 nm准分子激光刻蚀钠钙玻璃的裂损刻蚀机理,最后通过变换工艺参数来设计新的加工工艺流程以改善加工质量.实验结果表明,随着刻蚀处激光能量密度的增加,玻璃微通道的边缘裂损程度增大,并且刻蚀表面粗糙度增大,刻蚀质量下降;另外发现激光刻蚀后的粗糙表面可以增加玻璃材料对入射激光能量的吸收率,从而降低了激光刻蚀玻璃材料的阈值,较低的激光能量密度可降低刻蚀面的粗糙度.最后工艺流程改进实验,所加工的微通道质量得到改善,玻璃微通道边缘裂损尺寸小于5μm,底面粗糙度Ra值可降低至1.5 μm,研究结果将对激光加工玻璃微结构的质量改善提供一定的参考.“,”The soda-lime glass micro-groove is etched directly by 248 nm excimer laser to produce Bio-chip,which have great advantage and potentiality,but there are many problems now,such as it is easy to crack and the roughness of the groove bottom surface is very poor.Based on 248 nm excimer laser,two ways of processing soda-lime glass are used to study the low carcking in this paper,which are static etching and scanning etching.Firstly,the relationship between the process parameter and the quality of the glass micro-groove is studied by experiment,and then the mechanism of glass cracking processed by 248 nm excimer laser is analyzed.Finally,we have improved the process of etching glass micro-groove to improve the quality,which is changing the process parameter.From the experiment results,as the laser fluence increasing,the crack degree at the glass micro-groove edge is increasing and the roughness on the etching surface is also increasing,so the quality of the glass micro-groove is more and more poorer.The rough surface etched by laser can increase the absorption of incident laser energy,so the threshold of the laser etching glass material can be reduced,and the roughness of the etching surface can reduced by the lower laser fluence.From the experiment of process improved,the quality of the glass micro-groove is improved,the crack size at the glass micro-groove edge is less than 5 μm,the roughness of the bottom surface Ra can be reduced to 1.5μm.So the results of this paper will provide a reference to improve the quality of laser processing glass microstructure.