论文部分内容阅读
无线通信装置及灵巧型便携式电子产品的飞速发展及大量上市,促进了表面安装技术(SMT)及表面安装器件(SMD)相应的发展。各种各样的SMD器件层出不穷,并且成本也不断降低,甚至有些器件比有引线的同类器件价钱还便宜。 多层陶瓷片状电容器 多层陶瓷片状电容器是贴片式电容器中用得最广的一种。符合EIA尺寸的电容器在1pF～2.2μF之间。另外还有大容量的品种,其电容量在1.5～47μF之间,其尺寸为
The rapid development and mass market of wireless communication devices and smart portable electronic products has led to the corresponding development of surface mount technology (SMD) and surface mount devices (SMDs). A variety of SMD devices emerge in an endless stream, and the cost is also declining, and even some devices are cheaper than similar devices with leads. Multilayer Ceramic Chip Capacitors Multilayer ceramic chip capacitors are the most widely used chip capacitors. EIA-sized capacitors range from 1pF to 2.2μF. In addition there are large-capacity varieties, the capacitance between 1.5 ~ 47μF, its size