发热的半导体可能失效,而半导体的失效会引起灾难性的后果。人造卫星因此而不能正常运行。电子计算机可能出故障。汽车可能开不动。保证并提高可靠性的关键是将电子设备中半导体的结温维持在一个安全工作值。一般认为,将半导体的最高结温每降低10℃,半导体的失效率就减半。到底如何对电子元件和电子系统进行冷却呢?这一问题由于组装密度的提高而变得更加复杂。某些设计人员对传热技术的数量概念、名词术语等不甚熟悉,因此往往忽视了对传热器和传热系统的选择。而传热器的制造厂家,使用传热术语混乱,所定规格不一。当由于在设计的早期阶段忽略了散热问题而需要付出很大的代价时,热线路设计就成了 Fever semiconductors may fail, and the failure of semiconductors can have catastrophic consequences. As a result, satellites can not operate normally. Computer may be malfunctioning. The car may not move. The key to ensuring and improving reliability is to maintain the semiconductor junction temperature of the electronics at a safe operating value. It is generally believed that by reducing the semiconductor maximum junction temperature by 10 ° C, the semiconductor failure rate is halved. How to cool electronic components and electronic systems in the end? This problem is due to the increased assembly density has become more complicated. Some designers are not familiar with the concepts of quantity, terminology, etc. of heat transfer technology, and therefore often neglect the choice of heat transfer and heat transfer systems. The heat transfer of the manufacturer, the use of heat transfer terms confusion, the different specifications. Hot-line design becomes a big cost when it comes to neglecting the thermal issues in the early stages of the design