在模片密度不断增加和焊接空间有限的设计中，必须缩小混合电路和多模块组件上的连接间距，但是，在缩小焊接空间时，由于诸如引线和毛细管之间的接触干扰的增加，可能造成成品率的降低。库利克──索法工业公司研制了一种以PC为基础的软件模型，用于模拟焊接空间尺寸的大小对? In designs where the die density is increasing and the welding space is limited, it is necessary to reduce the connection pitch between the hybrid circuit and the multi-module assembly, however, an increase in contact noise such as a lead and a capillary may be caused when the welding space is reduced Yield reduction. Kulik-Sofia Industries has developed a PC-based software model for simulating the size of a welding space.