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为满足日益提高的半实物仿真实验对目标背景图像源的要求,研究了一种微加工工艺制得的光纤阵列结构的可见光/红外图像转换器。建立了利用二次辐射原理实现可见光/红外图像转换的光纤阵列面板的三维模型,利用有限元热力分析光纤阵列温度响应的最高温度和时间特性随加载热量的关系,实验中,单个光纤阵列端面加载热功率为5μW时,转换器实现温度响应的最高温度超过420K,温度响应的上升和下降时间达0.1ms。结果表明:相比薄膜形式转换器,该光纤阵列结构的可见光/红外图像转换器在机械强度、耐高温等方面的性能有所提高,可以为红外成像半实物仿真实验提供高温高帧频的背景图像源。
In order to meet the requirement of target background image source in increasingly advanced hardware-in-the-loop simulation experiments, a visible / infrared image converter with optical fiber array structure fabricated by micromachining technology was studied. The three-dimensional model of the optical fiber array panel using visible light / infrared image conversion based on the principle of secondary radiation was established. The maximum temperature and time characteristics of the temperature response of the optical fiber array with the heat load were analyzed by finite element analysis. In the experiment, When the thermal power is 5μW, the maximum temperature of the converter to achieve temperature response exceeds 420K, the temperature response rise and fall time of 0.1ms. The results show that compared with the thin film form converter, the optical fiber array structure of the visible / infrared image converter has the advantages of improved mechanical strength and high temperature resistance, and can provide high temperature and high frame rate background for the semi-physical simulation of infrared imaging Image source.