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针对铝合金无法直接烙铁钎焊的问题,本文提出了一种表面改性焊接的新方法:采用离子注入与磁控溅射相结合的技术在2024铝合金表面制备Cu膜,并实现了铝合金的低温钎焊。实验中通过改变基体偏压,研究不同参数对Cu膜的沉积速率、表面形貌、相结构以及低温钎焊性能的影响。结果表明:随着偏压幅值的增大,Cu膜的沉积速率逐渐下降,表面粗糙度先降低后增大,Cu膜呈现出较强的(111)择优取向;Cu膜的镀制改善了铝合金的低温钎焊性能,当偏压为-300 V时,所得钎焊接头剪切强度可达24.47 MPa,接头断口微观形貌呈现出局部拉长且方向一致的韧窝。
Aiming at the problem that the aluminum alloy can not be directly soldered by soldering iron, a new method of surface modification welding is proposed in this paper. The Cu film is prepared on the surface of 2024 aluminum alloy by the combination of ion implantation and magnetron sputtering and the aluminum alloy Low temperature brazing. In this experiment, the influence of different parameters on the deposition rate, surface morphology, phase structure and low-temperature brazing performance of Cu films was investigated by changing the substrate bias. The results show that with the increase of bias voltage, the deposition rate of Cu film decreases gradually, the surface roughness decreases first and then increases, and the Cu film shows a strong (111) preferential orientation. The Cu film plating improves When the bias voltage is -300 V, the shear strength of the obtained brazed joint reaches up to 24.47 MPa. The micro-morphology of the fracture surface of the joint shows a locally elongated dimple with the same direction.