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提出一种主动式多孔微热沉系统来实现高热流密度电子元器件封装散热的需求,分析了多孔微热沉系统的工作原理和特点。对多孔微热沉进行了高热流密度下的流动与传热实验研究,实验结果表明微热沉在高热流密度加热下能较快达到平衡;微泵驱动循环水流量为5.1cm3/s时,多孔微热沉的散热热量达到200W,散热热流高达100W/cm2,对应节点温度为55.8℃,系统压降为17.7kPa;Nu数随Re数增加而增加,Re在323时,Nu达到最大值518;随着流量以及加热热量的增加,微热沉平均换热系数增加,其最高换热系数为36.8 kW(m2℃)1。多孔微热沉系统能有效解决高热流密度电子元器件的散热问题,提高器件可靠性与使用寿命。
An active porous micro-heat sink system is proposed to realize the heat dissipation of high heat flux density electronic components. The working principle and characteristics of the porous micro-heat sink system are analyzed. Experiments on the flow and heat transfer of porous micro-heat sink under high heat flux density show that the micro-heat sink can reach the equilibrium quickly under the condition of high heat flux density. When the circulating water flow of the micro-pump is 5.1cm3 / s, The heat of the porous micro-heat sink reached 200W, the cooling heat flow was as high as 100W / cm2, the corresponding node temperature was 55.8 ℃ and the system pressure drop was 17.7kPa. The Nu number increased with the increase of Re number, and Nu reached the maximum value of 518 The average heat transfer coefficient of micro-heat sink increases with the increase of flow rate and heating heat. The maximum heat transfer coefficient is 36.8 kW (m2 ℃) 1. Porous micro-heat sink system can effectively solve the problem of heat dissipation of high heat flux density electronic components to improve device reliability and service life.