电子工业部第四十四研究所已成功地研制出探测器光纤耦合全金属气密封装技术,并于一九八七年一月通过技术鉴定。该项技术大部分采用传统电真空封装工艺,所以无需更新重大专用设备,整个工艺简单,成本低,封装工效比环氧封装快10倍以上,适合我国光纤耦合金属气密封装的推广使用。工艺特征参数:190～200℃时,5～10秒钎焊 The 44th Institute of the Ministry of Electronics Industry has successfully developed the detector fiber-coupled all-metal hermetic packaging technology and passed the technical appraisal in January 1987. The technology uses most of the traditional electric vacuum packaging process, so no need to update major special equipment, the entire process is simple, low cost, packaging efficiency more than 10 times faster than the epoxy package, suitable for China’s fiber-coupled metal hermetic packaging to promote the use. Process characteristics parameters: 190 ~ 200 ℃, 5 ~ 10 seconds brazing