采用固相反应法制备电子工业用BaZr_xTi_(1-x)O_3材料,研究不同烧结温度和时间的物相组成、显微组织形貌和介电性能。结果表明,随着烧结温度的升高,BaZr_xTi_(1-x)O_3中的物相组成没有明显变化,但结构由四方体变为立方体;当烧结温度从1 250℃升高至1 350℃时,材料的平均晶粒尺寸从29μm增加至39μm;当晶粒尺寸较小时,材料主要形成90°畴和180°畴,增加晶粒尺寸,材料主要形成180°畴。 BaZr_xTi_ (1-x) O_3 for electronic industry was prepared by solid-state reaction method to study the phase composition, microstructure and dielectric properties at different sintering temperature and time. The results show that the phase composition of BaZr_xTi_ (1-x) O_3 does not change significantly with the increase of sintering temperature, but the structure changes from tetragonal to cubic. When the sintering temperature is increased from 1 250 ℃ to 1 350 ℃ , The average grain size increases from 29μm to 39μm. When the grain size is small, the material mainly forms 90 ° domain and 180 ° domain, increasing the grain size, and the material mainly forms 180 ° domains.