论文部分内容阅读
试验研究了三种半导体致冷电对金属化系统的拉伸强度，其中铋─镍─锡金属化系统与半导体致冷材料粘接强度最高，超过原始棒状材料的拉伸强度，它是半导体致冷器电对的最好的金属化系统．
Tensile strength of three kinds of semiconductor cooling electric-to-metalization systems was experimentally studied. Among them, the bismuth-nickel-tin metallization system has the highest bonding strength with the semiconductor refrigerant, exceeding the tensile strength of the original rod-shaped material. The best metallization system for the cooler pair.