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引言本文介绍单块半导体网络整体电路的目前技术状况。文中着重讨论半导体网路的五种技术:扩散、外延、光刻、薄膜和厚膜。此外,还讨论了各种元件的隔离方法。以“通常的”有源器件结构的制造作为讨论的基础。文中没有考虑更复杂的新器件,如金属-氧化物-半导体(MOS)和金属-基极晶体管等。工艺扩散扩散过程早就成了半导体工艺师精确控制掺杂杂质量的工具。现象基本上是统计性质
Introduction This article describes the current state of the art in monolithic semiconductor network. The article focuses on five technologies for semiconductor networks: diffusion, epitaxy, lithography, thin films, and thick films. In addition, the isolation of various components is discussed. The fabrication of “normal” active device structures is the basis for discussion. The article does not consider more complex new devices, such as metal - oxide - semiconductor (MOS) and metal - base transistor. The proliferation of diffusion process has long been the semiconductor technology division precise control of the amount of impurities doped tools. The phenomenon is basically statistical in nature