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利用XRD,SEM手段研究了铸态Mg-5Sn-(0~2.0)Cu合金的显微结构。结果表明Mg-5Sn合金由枝晶状的α-Mg和Mg2Sn相组成,Cu的加入使合金出现Mg2Cu相。随着Cu含量的增加,晶粒逐渐细化,Mg2Sn相和Mg2Cu相的量也逐渐增加,但是这两种相的尺寸亦随之增加。室温拉伸结果表明,Cu质量分数在0.5%~1.0%时对合金起促进作用,然而,过多的Cu会弱化合金的拉伸性能。Mg-5Sn-1.0Cu合金具有最优的力学性能,抗拉强度达到180 MPa,延伸率达到12%。合金在温度为175℃,载荷为35~75 MPa的压蠕变性能表明,Cu可以提高Mg-Sn合金的抗蠕变性能。
The microstructure of as-cast Mg-5Sn- (0-2.0) Cu alloy was studied by XRD and SEM. The results show that the Mg-5Sn alloy consists of dendritic α-Mg and Mg2Sn phases, and the addition of Cu makes the alloy appear Mg2Cu phase. With the increase of Cu content, the grains gradually refine, the amount of Mg2Sn phase and Mg2Cu phase also gradually increase, but the size of these two phases also increases. Tensile tests at room temperature show that the Cu content of 0.5% ~ 1.0% promotes the alloy, however, excessive Cu weakens the tensile properties of the alloy. Mg-5Sn-1.0Cu alloy has the best mechanical properties, tensile strength of 180 MPa, elongation of 12%. The compressive creep properties of the alloy at a temperature of 175 ° C and a load of 35 to 75 MPa indicate that Cu can improve the creep resistance of the Mg-Sn alloy.