中小功率半导体管引线(下称引线),一般使用Ni29Co18可伐合金.规格为φ0.45mm或φ0.52mm,外部镀Ni、Au保护层.其零件生产工艺为:校直去油→预氧化→切丝→熔封→酸洗电镀.断裂多在器件成品以后,且大部在腿跟部或距腿跟部5～10mm处.综合我们1979年以来对不同类型样品的分析,以及不同镀层的工艺试验,认为引线断裂系阴极镀层引起的应力腐蚀所至.其中脆断占有较大比例.本文试图侧重工艺因素对引线断裂的影响予以探讨. Small and medium-power semiconductor tube leads (hereinafter referred to as lead), the general use of Ni29Co18 Kovar. Specifications for φ0.45mm or φ0.52mm, external plating Ni, Au protective layer. The parts production process: straightening to oil → pre-oxidation → Shredding → melt sealing → pickling electroplating.Most fractures in the device after the product, and most of the heel or heel from the heel 5 ~ 10mm.According to our analysis of different types of samples since 1979, as well as different coating According to the technological experiment, it is considered that the lead fracture is caused by the stress corrosion caused by the cathode coating, of which brittle fracture occupies a large proportion.This paper attempts to focus on the influence of the technological factors on the lead fracture.