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随着电子科学技术的发展,印制板的应用越来越广泛,已逐步普及到各个工业领域。为保证电子设备运行的可靠性,就必须提高印制板的制造质量以及对印制板设计和使用的合理性,不使印制板导线产生过热。国内从前对印制板导线的温度测量,一般是采用点温计,用这种方法测量是不太理想的。现介绍一种适用于印制板导线温升的测试方法——比较法。
With the development of electronic science and technology, the application of printed boards is more and more widely, and has gradually spread to various industrial fields. In order to ensure the reliability of the operation of electronic equipment, it is necessary to improve the manufacturing quality of printed circuit boards and the rationality of design and use of printed circuit boards without overheating the printed circuit board leads. In the past, the temperature of printed wiring board in our country was generally measured by point thermometer. It is not ideal to measure with this method. Is now introduced to a printed circuit board temperature rise test method - comparison method.