热压烧结对NTC热敏电阻稳定性的影响

来源 :传感技术学报 | 被引量 : 0次 | 上传用户:kevin_fisker
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对Co-Mn-Ni-O热敏材料进行热压烧结,其材料密度由4.92g/cm~3提高到5.48g/cm~3.以此热压烧结材料制成的热敏电阻,其稳定性提高了一个数量级(同非热压烧结材料相比较).SEM分析表明此材料的晶粒细小、均匀、气孔少,是提高其稳定性的主要原因. The material of the Co-Mn-Ni-O heat-sensitive material is hot-pressed to a density of 4.92 g / cm 3 to 5.48 g / cm 3, and the thermistor made of the hot-pressed sintered material is stabilized The properties were improved by one order of magnitude (compared with non-hot-pressed sintered materials), and SEM analysis showed that the grain size of the material is small and uniform, with fewer pores, which is the main reason for its stability improvement.
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