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红外焦平面器件的可靠性是目前制约焦平面工程化应用的主要因素,而器件在温度循环条件下导致的衬底断裂、In柱脱开等问题又是影响器件可靠性的主要因素。温度循环下的可靠性问题是由器件组成材料的热膨胀系数不同而产生的热应力造成的,为保证器件在温度循环或温度冲击条件下的可靠性,就必须使器件衬底内部和互联In柱所承受的应力在其断裂强度之内,对器件结构进行优化设计是适用于中等规模器件提高温度循环可靠性的主要方法,本文针对这一问题提出了结构设计优化的主要思路,结合某红外焦平面器件,采用有限元软件仿真方法进行了结构优化设计,并通过实验证明了结构设计的正确性和可行性。
The reliability of the infrared focal plane device is the main factor restricting the engineering application of the focal plane at present. The problems such as the substrate rupture and the dislodging of the In column caused by the device under the temperature cycling are the main factors affecting the reliability of the device. The problem of reliability under temperature cycling is caused by the thermal stress caused by the different thermal expansion coefficients of the device components. To ensure the reliability of the device under temperature cycling or temperature shock conditions, the device substrate must be interconnected with the In column The stress to be within its breaking strength, the optimal design of the device structure is suitable for medium-sized devices to improve the reliability of temperature cycling the main method of this paper proposed structural optimization of the main ideas, combined with an infrared focal Plane device, the structure optimization design is carried out by using the finite element software simulation method, and the correctness and feasibility of the structure design are proved through experiments.