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为探索新型热沉用散热材料,采用高温高压方法烧结制备了金刚石/硅复合材料,并研究了金刚石大小粒度混粉、金刚石含量、渗硅工艺以及金刚石表面镀钛对复合材料的致密度和导热性能的影响.结果表明:在大粒度金刚石粉中掺入小粒度金刚石粉、渗硅和金刚石表面镀钛处理都可提高金刚石/硅复合材料的致密度和热导率;随着金刚石含量增大,复合材料热导率提高;其中75/63μm镀钛金刚石颗粒与40/7μm金刚石颗粒的混粉,当混粉质量分数为95%时,在4～5GPa、1400℃高温高压渗硅烧结,金刚石/硅复合材料的热导率可高达468.3W.m-1.K-1.
In order to explore the new heat sink material for heat sink, the diamond / silicon composite was prepared by sintering at high temperature and high pressure. The effects of diamond size, mixed powder, diamond content, silicon infiltration process and diamond plating on the densification and thermal conductivity Performance of diamond / silicon composites.The results show that the incorporation of small-sized diamond powder into large-size diamond powder, siliconizing and diamond plating can increase the density and thermal conductivity of the diamond / silicon composites. With the increase of diamond content , And the thermal conductivity of the composites increased. Among them, 75/63 μm titanium-coated diamond particles and 40/7 μm diamond particles were mixed together. When the mixed powder mass fraction was 95%, the samples were infiltrated at 4 ~ 5GPa and 1400 ℃, / Si composite thermal conductivity can be as high as 468.3Wm-1.K-1.