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本文介绍在IBM系列及其兼容系列微型机上,实现硅压力传感器中硅杯结构的应力分析方法和软件.该软件对微机软、硬件资源的要求很低,能对包括工艺误差在内的各种复杂的硅杯结构绘出准确的应力分析图.
This paper introduces the stress analysis method and software for silicon cup structure in silicon pressure sensor on IBM series and its compatible series microcomputers.This software has very low requirements on the software and hardware resources of the microcomputer and can provide various stress analysis methods Complex silicon cup structure to draw accurate stress analysis diagram.