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对Bi在Cu双晶中的晶界偏聚实验观察结果进行分析。利用平衡晶界偏聚(EGS)模型和非平衡晶界偏聚(NGS)模型,分别对500°C时Bi在Cu双晶中的等温偏聚动力学和退火24 h的等时偏聚动力学进行研究。从定性分析和定量计算分析两方面推断出Bi的晶界偏聚特征与非平衡偏聚理论十分符合。根据非平衡晶界偏聚理论动力学模型,计算得到Bi-空位复合体扩散系数Dc=7.8×10-5exp[-1.46/(kT)],以及Bi原子的表观扩散系数DAi=7.66×10at+bexp[-1.76/(k T)],其中,a=8.45×10-8,b=-13.37。这些数据有助于对Cu合金中Bi所导致的脆化进行预测和控制的研究。
The experimental results of Bi segregation in the grain boundary of Bi were analyzed. The isothermal segregation kinetics of Bi in Cu bicrystal at 500 ° C and the isotropic segregation kinetics at 24 h of annealing were investigated by using equilibrium grain boundary segregation (EGS) model and non-equilibrium grain boundary segregation (NGS) model respectively. Learn to study. It is inferred from both qualitative analysis and quantitative analysis that the grain boundary segregation characteristics of Bi are in good agreement with the theory of non-equilibrium segregation. The diffusion coefficient of Bi-vacancy complex Dc = 7.8 × 10-5exp [-1.46 / (kT)] and the apparent diffusion coefficient of Bi atom DAi = 7.66 × 10at + bexp [-1.76 / (k T)], where a = 8.45 × 10-8, b = -13.37. These data help to predict and control Bi-induced embrittlement in Cu alloys.