论文部分内容阅读
热固性聚酰亚胺作为一类先进的基体树脂,在航空航天、印制电路板、高温绝缘材料等领域的应用不断扩大。相对于热塑性聚酰亚胺来说,热固性聚酰亚胺具有更好的可加工性能。而且,其加工窗口温度可通过变换不同反应性端基来实现。若选用合适的反应性端基,其在固化时无小分子挥发物放出。对热固性聚酰亚胺的研究现状分类作了综述,对降冰片烯、烯丙基降冰片烯、乙炔基、苯乙炔基、马来酰亚胺、苯基马来酰亚胺、苯并环丁烯等封端型热固性聚酰亚胺的研究进展进行了重点阐述,对它们结构与性能的关系、齐聚物的固化机理等进行了讨论,并对其在印制电路板上的应用和发展趋势作了概述和展望。
As a kind of advanced matrix resin, thermosetting polyimide has been widely used in the fields of aerospace, printed circuit board and high temperature insulating material. Thermosetting polyimides have better processability relative to thermoplastic polyimides. Moreover, its processing window temperature can be achieved by changing different reactive end groups. If a suitable reactive end group is chosen, it will not release any small molecules of volatiles during curing. The current status of research on thermosetting polyimides is reviewed in this paper. For norbornene, allylnorbornene, ethynyl, phenylethynyl, maleimide, phenylmaleimide, benzo Butene and other end-capped thermosetting polyimides are discussed emphatically, the relationship between their structure and properties, the curing mechanism of oligomers are discussed, and its application in the printed circuit board and The development trend is summarized and forecast.