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探讨了模压电感在低温烘烤后绝缘阻抗突变的原因,并试图找到改善绝缘阻抗的方法。研究发现,金属软磁粉末及其包覆层之间的表面结合力随着温度升高先升高后降低,且该包覆层物质随着温度的升高而脆化。证明绝缘阻抗突变的原因在于包覆层物质在固化过程中的体积变化和固化产物引起表面结合力的变化,且固化程度越高,包覆层越脆,二者相互作用后使得包覆层产生剥皮甚至脱落,从而造成模压电感在烘烤后绝缘阻抗失效。
The reason of the sudden change of the insulation resistance after the low temperature baking was discussed, and the method of improving the insulation resistance was tried. It was found that the surface adhesion between the metal soft magnetic powder and its coating first increased and then decreased with the increase of temperature, and the coating material became brittle with the increase of temperature. The reason for the sudden change in insulation resistance is that the volume change of the coating material in the curing process and the change of the surface binding force caused by the cured product and the higher the curing degree are, the more brittle the coating layer is, and the two are caused to interact with each other to produce the coating layer Peeled or even fall off, resulting in molded insulation after insulation resistance failure.