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可裸焊接合的引线框架是指在集成电路组装时将电路片和引线直接焊接到引线框架表面上不需要采取传统的镀银，不仅节省了镀银费用而且还大大缩短了组装时间．日本神产钢铁公司开发了两种可裸焊接合的材料DKLF合金和KFC合金．DAnF合金是已取得专利权的铜基合金，DKLF－5的成分是C
Solderable lead frame refers to the circuit board and the lead directly soldered to the surface of the lead frame assembly does not need to take the traditional silver-plated, not only saves the cost of silver but also greatly shorten the assembly time. Japan’s Shenchu Iron and Steel has developed two kinds of bare solder joint material DKLF alloy and KFC alloy. DAnF alloy is a patented copper-based alloy, DKLF-5 composition is C.