论文部分内容阅读
第17届国际电加工会议于2013年4月9~12日在比利时鲁汶举行,由鲁汶大学承办。作为国际特种加工学术界最高级别的会议,也是总部设在欧洲的国际生产工程研究院(CIRP)的系列国际会议,吸引了来自世界各大学及顶级厂商的160余名代表参加,他们分别来自17个国家和地区。其中参加会议的中国大陆代表近30名,分别来自12家高校及研究所。本次会议共录用论文108篇,论文集在Elsevier公司的网站公开发表。
The 17th International Electroplating Conference was held in Leuven, Belgium on April 9-12, 2013 and hosted by the University of Louvain. As the world’s top academic conference for specialty processing, it is also a series of international conferences of the International Institute of Production Engineering (CIRP) based in Europe, attracting more than 160 representatives from universities and top manufacturers from 17 A country and region. Nearly 30 representatives from mainland China attended the meeting, from 12 universities and research institutes respectively. A total of 108 papers were used in the conference and the papers were published on Elsevier’s website.