据iSuppli分析,尽管中国在2004年迈出了12英寸晶圆制造的第一步,中国芯片工业的大宗晶圆扩展,在2010年前仍将由新的6英寸与8英寸工厂所主导。能够迅速提升产能以及高昂的12英寸晶圆厂费用是两个关键的考虑。再者,因 According to iSuppli’s analysis, although China took the first step toward 12-inch wafer manufacturing in 2004, the substantial wafer expansion of China’s chip industry will still be dominated by the new 6-inch and 8-inch factories by 2010. Being able to quickly ramp up capacity and the high cost of 12-inch fabs are two key considerations. Again, because