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针对原curamik微通道热沉因进水通道流量不均而导致散热不均匀的现象,基于FLUENT软件对其进行数值模拟。从内部结构及热沉材料方面提出优化方案,并进一步获得在热沉高度和进出口宽度为固定值的条件下,微通道宽度、间距及通道脊长度3个因素分别对芯片表面温升和压降的影响规律。根据优化的参数,通过选区激光熔化技术制备获得纯镍微通道热沉并进行芯片封装测试。结果显示,微通道热沉散热均匀,热阻为0.39K/W,压降为140kPa,能够满足输出功率为80 W的半导体激光器单巴条芯片的散热要求。
For the original curamik microchannel heat sink due to uneven water flow channels lead to uneven heat dissipation, based on FLUENT software to simulate it. From the internal structure and heat sink material aspects of the optimization program and further access to the height of the heat sink and the inlet and outlet width of the fixed value of the conditions, the microchannel width, spacing and channel ridge length of the chip surface temperature and pressure respectively Fall of the law of influence. According to the optimized parameters, a pure nickel microchannel heat sink is obtained by the selective laser melting technique and the chip package is tested. The results show that the microchannel heatsink has the advantages of uniform heat dissipation, thermal resistance of 0.39K / W and pressure drop of 140kPa, which can meet the heat dissipation requirements of semiconductor laser bar with output power of 80W.