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根据热传导原理,在拉制微结构光纤(MSF)时,在高温区中,MSF预制棒的包层内不同位置加热的温度也不一样,且由表面往中心方向温度逐渐下降,温度梯度随MSF预制棒下棒速度的加快或包层空气填充率的减少而增大.由于材料的表面张力和黏度系数都是温度的函数,因此将MSF预制棒拉细成MSF时,实际所得到的MSF结构,并非是预制棒等比例的缩小,而是温度越高的空气孔形变量越大.为得到符合设计要求的MSF,就必须将MSF预制棒包层空气孔尺寸按温度变化规律设计,从而消除由于加热温度的非均匀性对拉制的MSF包层空气孔所产生的影响.
According to the principle of heat conduction, when the MSF is drawn, the temperature of heating in different positions in the cladding of the MSF preform is also different in the high temperature zone, and the temperature gradually decreases from the surface to the center. The temperature gradient changes with the MSF As preform rod speed increases or cladding air fill rate decreases, the MSF preform is attenuated to MSF due to both the surface tension and the viscosity coefficient of the material as a function of temperature. The resulting MSF structure , But not the reduction of preform, etc., but the higher the temperature, the greater the deformation of the air hole in order to meet the design requirements of the MSF, MSF preform cladding air holes must be dimensioned according to the temperature variation, thus eliminating Effect of non-uniformity of heating temperature on drawn air hole of MSF cladding.