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由于金涂层具有高的化学稳定性及低的接触电阻,所以它广泛应用于电子工业。但尚有显微硬度低(约100Kg/mm~2)、耐磨性差等缺点。为了改进金涂层的物理化学性能提出了某些合金,这种合金组织为金的固溶体晶或间化合物较适宜,由此可以显著改善机械特性。二元合金Au-Ag、Au-Sb的某些物理化学性能及其沉积条件,早已研究过了。本文提出Au-Ag-Sb三元合金沉积问题。
Due to its high chemical stability and low contact resistance, the gold coating is widely used in the electronics industry. But there are still low microhardness (about 100Kg / mm ~ 2), poor wear resistance and other shortcomings. In order to improve the physico-chemical properties of the gold coating, some alloys have been proposed, which are preferably gold-based solid solution crystals or intermetallic compounds, whereby the mechanical properties can be significantly improved. Some physicochemical properties and deposition conditions of binary alloys Au-Ag, Au-Sb have been studied. This paper presents the Au-Ag-Sb ternary alloy deposition problem.